In laying the first stone of its commercial plant for chip manufacturing in Odisha, India, it is on the brink of a historic and upcoming milestone. The SiC-based semiconductor manufacturing plant makes Odisha a leader in India’s nascent semiconductor network. It also quantifies and illustrates India’s ambitions to become a global center for semiconductor and electronic inventions.
The chip plant project, supported by a ₹2,066 crore investment, will be established at Bhubaneswar’s Info Valley, which is part of the state’s burgeoning electronics and clean technology landscape. The facility will produce high-voltage SiC components critical to the electric vehicle, renewable energy, railways, defence, and industrial automation sectors. The initiative affirms that it is the nation’s premier Silicon Carbide semiconductor fabrication unit, designed to emphasize the production of energy-efficient, high-performance components as India seeks to combine cutting its import bill and promoting emerging technology sectors. It is expected to generate about 750 direct and indirect jobs, promoting local hiring and skills distribution.
Odisha Chief Minister Naveen Patnaik and Union Minister of Electronics and Information Technology Ashwini Vaishnaw graced the groundbreaking ceremony. The Odisha government has taken a proactive stance to draw investment in the semiconductor sector by offering capital subsidies, which aligns with the central government’s efforts to establish semiconductor manufacturing units in different Indian states. This plant, established by RIR Power Electronics Limited, has been extensively supported by the state, including the Odisha Electronics and IT Department and the Odisha Computer Application Centre, which is providing the best incentives to the investor.
Semiconductor and electronic manufacturing incubation in Odisha also aligns well with the central Indian vision of ‘Make in India, For the World,’ as the latter aims to develop an indigenously reliant semiconductor ecosystem. Apart from this, several other semiconductor projects are underway in the state, such as the 3D Glass Solutions packaging unit, which has collaborations with tech giants including Intel, Lockheed Martin, and Applied Materials, validating Odisha’s foray into semiconductor innovation.
Apart from the commercial chip unit, the chip initiative in Odisha has seen its institutions, such as NIT Rourkela and Parala Maharaja Engineering College, integrated into India’s “Made in India” chip facilities. It therefore exports its indigenous innovations in semiconductor designs. These factors underlie the conducive infrastructure, talent, and investment-friendly climate in the state, setting a solid foundation for future semiconductor and its allied industries.
The Odisha semiconductor fab project is expected to commence commercial production by March 2026, marking a significant step towards India’s independence in semiconductor manufacturing and technological advancements in electric mobility, clean energy, and high-performance electronics.